Model: THP 35 series

The THP 35 series, is designed for PCB shops that need to fill blind & through hole in one step. A completely new patented type of vacuum filling heads were designed for this process. By using high vacuum under pressure that is applied to the filling area of the heads instead of low vacuum under pressure applied to an entire chamber. THP 35 series achieve the best filling results in the market.

Features

• Blind and through hole filling in one single step
• Compatible to all types of paste
• No paste outgrassing during the high vacuum filling process
• An internal cooling and heating system