Model: DSS ADVANCED

Features

• Selective double side hole filling for through and blind holes in one single process step
• Capable for filling of high aspect ratio holes (40:1)
• Small foot print
• Easy programming for different filling cycles
• Patented high vacuum filing system
• Wide range of panel thicknesses possible
• Clean and user-friendly handling of printed circuit boards after filling, as all border areas remain paste-free
• Absolutely flat surface on the filled holes
• Real-time display of the respective paste level
• Double screen system for different layout on the two panel sides
• Automatic locking of the screens after alignment with 4 CCD cameras