Atteipo
HF Pulse Bonding Machine

HF Pulse Bonding Machine

Model: SBM1000

SBM1000 is an innovative system for the bonding of multilayer boards. The aim of this system was to increase both bonding speed and energy savings.

  • High Frequency Pulse Bonding
  • Very high Speed : 2-3 times more productive than inductive systems
  • More stable : 12 bonding points (6+6) instead of the 4 of inductive systems
  • Soldered steel structure and cover
  • Two aluminum layup tables
  • Table movement driven by pneumatic cylinder featuring a safety circuit
  • Adjustment of tips’ distance by means of step motors controlled by PC
  • Circuit extraction from pins by means of a pneumatic system extraction automatically activated at the end of the cycle

Number of soldering points (each side)

6

Welded area

From 5x20 to 10x20mm

Maximum circuit dimension

762x610 mm

Minimum inner dimension

300x250 mm

Maximum soldering thickness

10 mm

Cycle time

(it depends on the number of layers and total thickness)

<120 sec

New job set up time needed

<2min

Number of pre-set temperature and cycle time sets 

> 1000

Supply voltage (monophase)

230Vac 50 Hz

Power supply consumption

<2 kW

Compressed air supply pressure

0.6-0.7 Mpa

Air consumption

<30 Nl/min

Weight

450 Kg

Machine dimensions

2.4 x 1.2 x 1.35 m

Working area

3.5 x 2 m

CE Approved

Yes