Atteipo
Electroplating chemicals

Electroplating chemicals

Model: VCF-760 series

  • Designed for blind via hole filling process
  • Filling ratio up to 90%
  • Good for high aspect ratio board

 

FEATURES

  • Conductivity: 0.59 mega-ohm/cm
  • Elongation: meet IPC-650 standard ＞15%
  • Tensile Strength: meet IPC-650 standard ＞30Kpsi
  • Thermal Shock: 6 cycles with NO cracking (288°C, 10sec)
  • Good Metal Distribution
  • Brightness: flat, smooth and bright
  • Uniform Current Density: 1.0 to 0 A/dm2
  • Additives analysis: use CVS(Cyclic Voltametric Stripping System)

ITEM

UNIT

RANGE

BEST CONDITION

CuSO4

g/L

220 - 260

240

H2SO4(98%)

g/L

40 - 80

60

CI-

ppm

50 - 80

60

VCF-760C

ml/L

20 - 40

30

VCF-S760L

ml/L

2 - 8

5

VCF-N760B

ml/L

0.5 - 2

1.2

Temperature

°C

19 - 25

22

Nozzle flow

kg/cm2

0.1 - 0.4

0.2

Current

A/dm2 

1.0 - 3.0 

1.8

Anode Material

 

IrO2 / Ti Anode